Please use this identifier to cite or link to this item:
http://hdl.handle.net/11718/26080
Title: | Robust pre-placement action offers relief in subdued job market |
Authors: | Basu, Sreeradha D Dadhwal, Prachi Verma |
Keywords: | Internship and pre-placement;Placement 2023;IIMs and IITs placement |
Issue Date: | 16-Feb-2023 |
Publisher: | Economic Times |
URI: | http://hdl.handle.net/11718/26080 |
Appears in Collections: | IIMA In Media |
Files in This Item:
File | Description | Size | Format | |
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ET_16_FEBRUARY_2023_AHMEDABAD.jpg | 859.96 kB | JPEG | View/Open |
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