| dc.contributor.author | Chandra, Pankaj | |
| dc.contributor.author | Gupta, S. | |
| dc.date.accessioned | 2010-10-08T11:34:42Z | |
| dc.date.available | 2010-10-08T11:34:42Z | |
| dc.date.copyright | 1997 | |
| dc.date.issued | 1997-10-08T11:34:42Z | |
| dc.identifier.uri | http://hdl.handle.net/11718/9474 | |
| dc.description | International Journal of Production Research, Vol. 35, No. 3, (1997), pp. 611-633 | en |
| dc.description.abstract | In this paper we study a semiconductor packaging line at IBM Bromont. At the
line, modules are assembled and then tested in a burn-in oven. The burn-in oven is a batch processing station. We outline a procedure to determine order release
schedule and lot sizes for the various work stations in the line, such that total manufacturing lead time is minimized. The internal parameters of the procedure
are set by simulation experiments and by heuristics. Sensitivity analysis is carried
out to determine the robustness of the procedure with respect to various external
parameter settings. | |
| dc.language.iso | en | en |
| dc.subject | Semiconductor | en |
| dc.subject | Lead Time | en |
| dc.title | Managing batch processors to reduce lead time in a semiconductor packaging line | en |
| dc.type | Article | en |
